DESCRIPTION
The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin?dual in-line package.

Features
■ Dual Channel Optocoupler
■ Convenient Plastic SOIC-8 Surface Mountable Package Style
■ Two channels in one compact surface mount package

DESCRIPTION
The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin?dual in-line package.

Features
■ Dual Channel Optocoupler
■ Convenient Plastic SOIC-8 Surface Mountable Package Style
■ Two channels in one compact surface mount package

DESCRIPTION
The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin?dual in-line package.

Features
■ >5mm creepage/clearance
■ Compact 4-pin surface mount package(2.4mm maximum standoff height)
■ Current Transfer Ratio in selected groups

DESCRIPTION
The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin?dual in-line package.

Features
■ >5mm creepage/clearance
■ Compact 4-pin surface mount package(2.4mm maximum standoff height)
■ Current Transfer Ratio in selected groups

DESCRIPTION
The general purpose optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 6-pin?dual in-line package.

Features
■ >5mm creepage/clearance
■ Compact 4-pin surface mount package(2.4mm maximum standoff height)
■ Current Transfer Ratio in selected groups

Features
■ CNY171/2/3/4 and CNY17F1/2/3/4 are also available in white package by specifying M suffix (eg. CNY17F2M)
■ UL recognized (File # E90700)

Features
? Current Transfer Ratio Ranges from 80 to 600% at IF = 5 mA,VCE = 5 V, TA = 25oC

Features
■ CNY171/2/3/4 and CNY17F1/2/3/4 are also available in white package by specifying M suffix (eg. CNY17F2M)
■ UL recognized (File # E90700)

FEATURES
? Two isolated channels per package
? Two packages fit into a 16 lead DIP socket
? Underwriters Laboratory (U.L.) recognized File E90700

Features
■ UL Recognized (File #E90700, Volume 2)
■ VDE Recognized (File #136616) (add option “V” for VDE approval, i.e, MOCD217VM)
■ Low Input Current (specified @ 1mA)

Features
■ Two isolated channels per package
■ Two packages fit into a 16 lead DIP socket
■ Choice of three current transfer ratios
■ Underwriters Laboratory (U.L.) recognized File E90700

Features
■ U.L. Recognized (File #E90700, Volume 2)
■ VDE Recognized (File #136616) (add option “V” for VDE approval, i.e, MOCD213VM)
■ Dual-channel Coupler

Features
■ Two isolated channels per package
■ Two packages fit into a 16 lead DIP socket
■ Choice of three current transfer ratios
■ Underwriters Laboratory (U.L.) recognized File E90700

DESCRIPTION
The MOCD211-M device consists of two gallium arsenide infrared emitting diodes optically coupled to two monolithic silicon phototransistor detectors, in a surface mountable, small outline plastic package. It is ideally suited for high density applications and eliminates the need for through-the-board mounting.

Features
■ Two isolated channels per package
■ Two packages fit into a 16 lead DIP socket
■ Choice of three current transfer ratios
■ Underwriters Laboratory (U.L.) recognized File E90700